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Featured Product
Bergquist
Liqui-Form 2000
Features and Benefits
- Thermal Conductivity: 2.0 W/m-K
- Applies very low force on components during assembly
- Low volumetric expansion
- Excellent chemical and mechanical stability even at higher temperatures
- No curing required
- Stable viscosity in storage and in the application
Liqui-Form™ 2000 is a high thermal conductivity liquid formable material designed for demanding applications requiring a balance between dispensability, low component stresses during assembly and ease of rework.
Liqui-Form™ 2000 is a highly conformable shear-thinning material which requires no curing, mixing or refrigeration. Its unique formulation assures excellent thermal performance, low applied stress and reliable long-term performance. Liqui-Form™ 2000 is thixotropic and has a natural tack ensuring it forms around the component and stays in place in the application.
Typical Applications Include:
- Bare die to heat spreader lid
- Filling various gaps between heat-generating devices to heat sinks and housings
- Devices requiring low assembly pressure
- BGA, PGA, PPGA
View new products from this and several of our other Manufacturers by visiting www.mouser.com/melfoster
Featured Associate — Kristine Hall
Kristine graduated from University of St. Thomas and started with Mel Foster in 2002. She works very closely between the distribution partners, manufacturers and customers to provide top level service across the board.
Besides cheering on the Huskers, she enjoys staying busy by working out, being outdoors, spending time with friends and family, scrap-booking, entertaining and spoiling her German Shepherd.
Seminars, Events, News
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May 6-9 2013
Electronics Distribution Show (EDS) 2013 → -
May 22, 2013
Power Seminar Hosted by Mel Foster →